Entrez un mot ou une phrase dans n'importe quelle langue 👆
Langue:
Traduction et analyse de mots par intelligence artificielle ChatGPT
Sur cette page, vous pouvez obtenir une analyse détaillée d'un mot ou d'une phrase, réalisée à l'aide de la meilleure technologie d'intelligence artificielle à ce jour:
- comment le mot est utilisé
- fréquence d'utilisation
- il est utilisé plus souvent dans le discours oral ou écrit
- options de traduction de mots
- exemples d'utilisation (plusieurs phrases avec traduction)
- étymologie
Qu'est-ce (qui) est Plastic Pin Grid Array - définition
TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE
SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array
 CPU-pins PNr°0295.jpg?width=200 "Closeup of the pins of a pin grid array")
![AM2+ socket]]](https://commons.wikimedia.org/wiki/Special:FilePath/AMD Phenom X4 9750 (Underside).JPG?width=200 "AM2+ socket]]")
![Underside of a [[Pentium 4]] in a PGA package](https://commons.wikimedia.org/wiki/Special:FilePath/Pentium 4 Underside Demonstrating PGA Socket.JPG?width=200 "Underside of a [[Pentium 4]] in a PGA package")
![The topside of a [[Celeron]]-400 in a PPGA packing](https://commons.wikimedia.org/wiki/Special:FilePath/UpSL3A2.JPG?width=200 "The topside of a [[Celeron]]-400 in a PPGA packing")
![A 1.2 GHz [[VIA C3]] microprocessor in a ceramic package](https://commons.wikimedia.org/wiki/Special:FilePath/VIA C3 C5XL CPGA.jpg?width=200 "A 1.2 GHz [[VIA C3]] microprocessor in a ceramic package")
![The underside of a [[Celeron]]-400 in a PPGA](https://commons.wikimedia.org/wiki/Special:FilePath/SL3A2down.JPG?width=200 "The underside of a [[Celeron]]-400 in a PPGA")
Plastic Pin Grid Array
<hardware, processor> (PPGA) The package used for certain
Intel Celeron processors. PPGA processors fit into
Socket 370 motherboard sockets.
The Plastic Pin Grid Array packaging is similar to that used
on Pentium processors. The silicon core is covered by a
heat slug that faces down toward the motherboard.
The Celeron 300A to the 533 use a PPGA package. The Celeron
566 onward use a FC-PGA package.
Celeron processors are also available in Slot 1 SEPP
packaging.
(2000-08-26)
Pin Grid Array
<hardware> (PGA) A style of integrated circuit socket or
pin-out with pins laid out on a square or rectangular grid
with a separation of 0.1 inch in each direction. The pins
near the centre of the array are often missing.
PGA is often used on motherboards for processors, e.g.
Socket 6 and Socket 8.
PPGA is "plastic PGA" (as opposed to ceramic?).
See also SPGA.
(2000-03-09)
Staggered Pin Grid Array
<hardware> (SPGA) A style of integrated circuit socket or
pin-out with a staggered grid of pins around the edge of the
socket, positioned as several squares, one inside the other.
SPGA is commonly used on motherboards for processors,
e.g. Socket 5, Socket 7 and Socket 8.
See also PGA.
[Better description? ]
(1999-08-04)
Wikipédia
Pin grid array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
